专利内容由知识产权出版社提供
专利名称：PACKAGING FOR ENCAPSULATING
MATERIAL
发明人：STIJNMAN, Paulus, Wilhelmus, Adrianus申请号：EP99920654.3申请日：19990413公开号：EP1073552A1公开日：20010207
摘要：Packing (1) encapsulating material (9) includes two films (2,3), these wrap up alarge amount of encapsulating materials (9). This packaging uses, for example, in transfermolding to encapsulate electronic building brick. The end (2) of the first film
encapsulates together stitches (4,5) by two end sockets. The connection of two films (2,3)is extended in parallel by film seam (6,7), along the other side for stitching (4,5) from anend socket. Film (2,3) formed at least one two-layer film valve (; B groups), the mold ofrunner is flowed into molding encapsulating material by these. Film valve (s) (; B groups)at least one film has one or more notch (8; 15,16,18) be located at least one neighbouringend socket and stitch (4 or 5), cut out portion film valve (; B, the film (20) of rectangularborder piece (; The short end socket seams (4,5) of the distance between B (21). Withstress caused by notch by the end socket seam (4,5) film valve (; B groups), thereforeundesired gauffer and ripple are eliminated.
申请人：\"3P\" Licensing B.V.
地址：Hengelder 16 6902 PA Zevenaar NL
国籍：NL
代理机构：Bakkum, Ruben Joseph
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