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专利名称：Soldering apparatus of a reflow type发明人：Kondo, Kenshi申请号：EP310078.4申请日：191003公开号：EP0363136A3公开日：19900808
摘要：A soldering apparatus of a reflow type contains a preheating chamber (22,23)and a reflow chamber (24) which are provided with a plurality of heaters (25) for heatingprinted circuit boards (1) with chips temporarily mounted thereon with solder pastes (3)during conveyance by a conveyor. The heaters (25) are mounted on the side walls of thechamber, extending along a direction of conveyance of the printed circuit boards (1). Thechambers are also provided with a screening member (26) respectively so as to preventdirect radiation of radiant heat from the heaters into the chambers and onto the printedcircuit boards and to provide a unform air flow so as to be blown uniformly onto theprinted circuit boards.
申请人：NIHON DEN-NETSU KEIKI CO., LTD.
地址：27-1, Shimomaruko 2-chome Ohta-ku Tokyo JP
国籍：JP
代理机构：Allam, Peter Clerk
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