X射线萤光光谱仪(XRF)检验规范分解

機密等級: 機密 Confidential Level: Confidential

USI Controlled Document Document Title(文件名稱) : X-Ray fluorescence test specification (X射線螢光光譜儀(XRF)檢驗規範) Document Number(文件編號): Revision(文件版本): Revise Date: Prepared by(撰寫者): Create by which Unit(制定單位) : AT-0801-M427 A6 6/26/2009 Edwin Huang 黃基泉 CQM/GRM/GD AG-0801-M006-F2 Rev.:A1

Amendment Records

Item: Date: Revision: Page: 1 03/31/2005 A2 6,7 2 04/10/2006 A3 7 3 04/10/2006 A3 6 4 05/05/2006 A1 All 5 05/05/2006 A1 6,7 Change Description: Changed by: 1.Delete the Cr from the item of XRF test. Eric Chang 2.Add remark. 1.Add remark 3 Eric Chang 包裝材料的測試值修改為: 鉛+汞+鎘+铬需Eric Chang 小於100ppm,其中需鎘小於5ppm Coding change from TT-0801-Q095 to Eric Chang TT-0801-M401 6 07/05/2006 7 11/30/2006 A1 A2 1. 修改附件一XRF測試零件及產品類別之Eric Chang 有害物質限值表規格之 Pb, Cr, Hg: 700ppm，增加Cd:60ppm之管制 2. 刪除Remark對Cr暫不設定管制上限之規定 1. Document coding change from Ken Ke All TT-0801-M401-A1 to AT-0801-M427-A1. 柯炤榕 2. Add the purpose and scope. 1. Omit that this program is practicable in Taiwan and China sites. 2. Modify Method 3: test point of PCB. 2,4,11 Edwin Huang 3. Remove Package item on attachment 1: the Cd must under 5 ppm. 10,12 1. Add halogen free and Spot test items. 2. Delete Br controlling item. Edwin Huang 8 9 10 04/29/2008 A3 08/20/2008 09/04/2008 A4 A5 1. Add attention items for the tool management process of mechanical 1,10, preparation. 12~14 2. Add the flow chart and form for the management process to attachment. Updated Attachment 1: EHS threshold 10~12 value of component type for XRF test 10 11 12 14 Edwin Huang Edwin Huang 11 06/26/2009 A6 1. Add test method if customer request 2. Delete” IQC won’t control the threshold value of Cl.. 3. Add “If the material composed of metal, Edwin Huang glass and ceramic. The component won’t be carried out halogen free.. 4. Updated AT-0801-M427-F1 to A2 version. AG-0801-M006-F3 Rev.:A1

目 錄 Content

一、 目的 Purpose

二、 適用範圍

Scope

三、 樣品檢測條件及方法

Test condition & method for sample

四、 零件及產品測試原則 Testing Rule

五、 測試方法 Test Method

六、 注意事項 Attention item

七、 附件

Attachment

1.XRF測試零件及產品類別之有害物質限值表限值表 EHS threshold value of component type for XRF test 2.拆解治工具管理流程

The management process for disassembly tools of the component. 3. XRF治工具季驗證紀錄表 (AT-0801-M427-F1)

The record of disassembly tools in quarter inspection by XRF (AT-0801-M427-F1).

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目的：

Purpose

本規範在建立進料之XRF檢驗標準，以確保品質合乎既定之標準。

The purpose of this program is to establish the specification of the XRF inspection for incoming materials to assure the quality of materials and comply with specified criteria. 一、 適用範圍：

Scope

適用於各大類零件之檢驗。 Apply to all types of materials.

二、 樣品檢測條件及方法：

Test condition & method

1.分析方法分為檢量線法及FP法，說明如下：

Test methods can be separated to the method of calibration curve and FP method.

1.1. 檢量線法：對應於XRF之分析條件為 ”Cd, Pb, Hg, Br, Cr.bcc”，適用之材質為塑料、紙

張、木材及Mg, Al, Si 較輕元素)為主材質之樣品。 Method of calibration curve: The method is used for plastic, paper, wood and some

materials mainly composing of Mg, Al, and Si. The analysis condition is ”Cd, Pb, Hg, Br, Cr.bcc”.

1.2. FP法：對應於XRF之分析條件為”metal 2.bfb”，適用之材質為金屬(較重元素)為主材質之

樣品。

FP method: The method is used for some materials mainly composing of heavy metal. The analysis condition is ”metal 2.bfb” .

四、零件及產品測試原則：

Testing Rule

1.金屬及塑料共存者: 平鋪於測試台並裁切至適當尺寸測試之。

The sample composed of metallic and plastic materials: Cut the sample to be suitable size in the test platform.

2.形狀凹凸不平者：測試點過高(超過0.5cm)時須拆解樣品，再取平整面測試(約1cm×1cm)。 The surface not bumpy: Separate the sample while the test point is higher than test platform (0.5 cm).

3.條狀金屬線者: 依其縱方向排列於測試台測試之。

The metallic sample shaped into bar type : Arrange it vertically in test platform. 4.鮮豔紅、黃、橙色者: 應優先量測(如油墨、塑膠類、PVC等)。

The sample painted by brightly red, yellow and orange color: Measure the point first (such as ink, plastic and PVC).

五、測試方法：

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Test Method: Method 1：

1.DIP類測試方法：以檢量線法測試。

DIP: test by the method of calibration curve.

1.1.本體大於1cm時：以本體為主並包括部分接腳進行測試(請參閱圖1) 。

Sample size > 1 cm: Focus on body and includes partial terminal (Refer to figure 1). 1.2.本體小於1cm時：包含本體及接腳測試(請參閱圖2)。

Sample size < 1 cm: Including the whole body and terminal (Refer to figure 2).

DIP類 DIP type

縱方向平鋪於測試台Put the sample in test platform vertically

本體含接腳之影像視窗圖 The test image including body and partial terminal.

圖1 DIP類(本體>1cm)量測流程

Figure 1 The test procedure for DIP type(sample size > 1 cm)

DIP類 DIP type

縱方向平鋪於測試台 Put the sample in test platform vertically

本體包含接腳之影像視窗圖 The test image including body and partial terminal.

圖2 DIP類(本體<1cm)量測流程

Figure 1 The test procedure for DIP type(sample size > 1 cm)

Method 2：以檢量線法測試。

Test by the method of calibration curve.

2.SMD類：分為長(L)，寬(W)，高(H)<2mm類及其他尺寸類。

SMD : Divide sample into two types, one is Length (L), width (W), or height (H)<2mm, and another is other dimension。

2.1.長(L)，寬(W)，高(H)<2mm：裝滿1/2樣品杯測試(請參閱圖3)。

Length (L), width (W), or height (H) <2mm: Fill up the 1/2 test cup with samples. (Refer

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to figure 3)

2.1.其他尺寸類：以pad或接腳為優先量測面(請參閱圖4)。 Other dimension: Focus on pad or terminal. (Refer to figure 3)

含pad之影像視窗圖

L，W，H<2mm類 L，W，H<2mm type

空樣品杯Φ=2.7cm

Test Cup

填裝1/2樣品杯 Fill up 1/2 cup with samples

圖3 SMD類填裝於1/2樣品杯之流程 Figure 3 Procedure for fill up 1/2 cup with SMD

type

其他尺寸類 Other Dimension

Test image including pad

圖4 測試含pad面之SMD類

Figure4 Procedure for SMD type including

pad

Method 3：以檢量線法測試。

Test by the method of calibration curve.

3.PCB類：測試點以涵蓋pad、文字、印刷線路為優先選擇,否則應依序分開測試(請參閱圖5)。 PCB: Test the pad、word、printed line by the method of calibration curve. (Refer to figure 5)

PCB Test image

圖5 含pad、文字、印刷線路點之PCB板測試部位

Figure 5 Test point including pad、word、printed line for PCB

Method 4：

4.電感，變壓器類：

Inductor and Transformer:

4.1.DIP類：分為漆包線外露(純金屬材質)所組成及外覆塑料之零件之兩種。

DIP: Divide into two types, one is Enamel-insulated wire that is obvious to display; and

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PCB板偵測點之影像視窗圖

another is covered with plastic.

4.1.1.漆包線外露之零件：FP法測試(請參閱圖6)。

Enamel-insulated wire is obvious to display: test by FP method (Refer to figure 6) 4.1.2.外覆塑料之零件：本體以檢量線法測試，接腳以FP法測試(請參閱圖7)。

The inductor with the plastic jacket: Test the body by the method of calibration curve, and the terminal by FP test method separately (Refer to figure 7)

電感 Inductor

平鋪於測試台 Put the inductor on test platform

偵測點之影像視窗圖

Test image

圖6 漆包線外露之電感測試流程

Figure 6 Procedure for enamel-insulated wire being obvious to display

本體之影像視窗圖

Body image

接腳之影像視窗圖

外覆塑料之電感 拆解為本體及接腳 Terminal image

The inductor with To separate the

the plastic jacket sample into body

and terminal 圖7 外覆塑料之電感之測試流程 Figure 7 Procedure for inductor with the plastic jacket

4.2.SMD類：

SMD type:

4.2.1.長(L)，寬(W)，高(H)<5mm：裝滿1/2樣品杯測試，並使用檢量線法。

Length (L), width (W), or height (H) <5mm: Fill up the 1/2 test cup with samples, and then test by the method of calibration curve.

4.2.2.長(L)，寬(W)，高(H)任一邊>5mm，則量測方式分為：

Any side on length (L), width (W), or height (H) >5mm: The test methods as the followings,

4.2.2.1.漆包線外露之零件：FP法測試(請參閱圖8)。

The component of enamel-insulated wire is obvious to display: test by FP method

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(Refer to figure 8)。

4.2.2.2.包覆漆包線之零件：含pad面為優先量測面(請參閱圖9)。若pad面之主材質為塑料時，

應以檢量線法測試。

The component of enamel-insulated wire being covered: Test the pad side first (Refer to figure 9). If the materials on pad side is composed of plastic, choose the method of calibration curve for test.

測試底部 Test the bottom

測試側邊 Test the side

漆包線外露之SMD元件 (頂面含鮮豔之油墨)

SMD component with enamel-insulated wire being obvious to display (Contain colorful ink)

測試頂部 Test the top side

圖8 漆包線外露之零件測試流程

Figure 8 Procedure for the SMD component of enamel-insulated wire

being obvious to display

包覆漆包線之SMD元件 測試pad面

Component with enamel-insulated wire Test the pad side

being covered

圖9 包覆漆包線之零件測試流程

Figure 9 Procedure for the component of enamel-insulated wire being covered Method 5：

金屬、塑膠材料類：樣品必須平貼測試，必要時將個別拆開(約1cm×1cm) (請參閱圖10)。 5.

Metallic and Plastic materials: The test side of sample shall be flat on the test platform, and it could be tested specifically if necessary.(about 1cmx1cm) (Refer to figure 9) 5.1.塑膠件：以檢量線法測試。

Plastic materials: test by the method of calibration curve. 5.2.複合材料：金屬類以FP法測試，塑料類以檢量線法測試。

Complex materials: Metallic materials are tested by FP method and plastic materials by the method of calibration curve.

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Test plastic

含塑料及金屬之機構件 無法平鋪於測試平台 拆解成金屬及塑料 測試金屬 Test metal Test sample including metal If the sample couldn’t be Separate the sample and plastic flat on the test platform 圖10 機構件之測試流程

Figure 10 Procedure for mechanical component 5.3.金屬件：分鋁(鎂)合金及其他非鋁(鎂)合金系列材質(如銅，鐵，鋅等)。

Metallic materials: separate to two portions, one is for Al or Mg alloy, another is for non-Al or Mg alloy (e.g. Cu, Fe, and Zn).

5.3.1鋁(鎂)合金(如heat sink，housing)：檢量線法測試(請參閱圖11)。

Aluminum (Al) or magnesium (Mg) alloy (e.g. heat sink and housing): test by the method of calibration curve (Refer to figure 11) 5.3.2其他非鋁(鎂)合金系列材質：FP法測試。

Non- aluminum (Al) or magnesium (Mg) alloy materials: test by FP method.

平鋪於測試台 Housing(Al)

Put the sample on test platform

圖11 金屬件之測試流程 Figure 11 Procedure for Metal component Method 6：

6.包裝材：檢量線法測試(必要時再裁切)。

測試塑料 Test plastic

Packaging materials: Test by the method of calibration curve (To cut the sample as the suitable size if necessary)

6.1.蓬鬆之包裝材：重疊高度至少3cm (請參閱圖12)。

Fluffy package materials: The thickness shall be taken a height of 3 cm at least (Refer to figure 12).

6.2.Label、說明書、tray盤類：重疊高度至少0.5cm。

Label, User manual and Tray: The thickness shall be taken a height of 0.5 cm at least.

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發泡棉 氣泡袋 瓦楞紙板

Sponge Bubble bag Corrugated

圖12 包裝材之測試流程

Figure 12.Procedure for packaging

Method 7：檢量線法測試( 針對外觀測試即可)

Test by the method of calibration curve (Only test the surface of sample) 7.周邊材料類：以鮮豔紅、黃、橙顏色之部位優先測試, 其次為外殼,導線等。

Periphery materials: Prefer to test the location painted by brightly red, yellow and orange, and then test outer covering in turn.

Method 8：檢量線法測試

Test by the method of calibration curve

8.PCBA板：插件之焊點處優先量測, 其次為SMD之焊點(請參閱圖12)。

PCBA: Prefer to test the solder joint of DIP components, and the second is the same area of SMD (Refer to figure 12).

8.1.Sample size 小於L:12cm W:15cm時，則任選2點焊點。

Sample size < L (12cm) and W (15cm) : Choose two solder joint randomly. 8.2.Sample size 超過 L:12cm W:15cm時，則任選4點焊點測試。

Sample size > L (12cm) and W (15cm) : Choose four solder joint randomly.

PCBA板

PCBA

Method 9：

SMD焊點放大圖 SMD view

插件之焊點放大圖 DIP view

測點距測試台過高 The gap is too big between sample and XRF

選擇SMD及插件 之焊點測試 To choose the solder area of DIP or SMD

圖13 PCBA板之測試流程 Figure 13 Procedure for PCBA

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9.若為上述未涵蓋之零件類別，請取其平整面進行測試，並以鮮豔顏色如紅、黃、橙色之油墨，以及pad為優先量測點。 If there are the other material type that didn’t be covered above, they are preferred to test the flat side of the pad and the location painted by brightly red, yellow or orange. 9.1.塑料材質以檢量線法進行測試。

Plastic materials have to test by the method of calibration curve. 9.2.金屬部分以FP法進行測試。

Metallic materials have to test by FP method.

六、注意事項：

Attention item:

1.零件及產品經XRF試驗後之測定值應依XRF測試零件及產品類別之有害物質限值表（參照附件1）進行確認程序。 After the testing by XRF, the result should be verified by attachment 1.

2.當總鉻含量超過附件一的限值時，且零件含有金屬外層時，得依照AT-0801-M428《金屬樣品塗覆鉻酸鹽之六價鉻存在之斑塊測試方法》之化學檢測方法確認。 If the XRF test result over threshold value in Cr with metallic coating, then follow up

AT-0801-M428《Spot Test for the Presence of Hexavalent Chromium (Cr VI) in Chromate Coating on Metallic Samples》to make sure whether contain (Cr VI). 3. 拆解治工具管理注意要項(管理流程如附件二)：

The management process for disassembly tools of the component. (See attachment 2) 3.1拆解治工具須經XRF驗證符合規範後始得使用，否則須另購新治工具並經檢測合格為止。

The disassembly tools should pass through XRF inspection and qualification. Or else, IQC should purchase the new tools then qualify them by XRF inspection.

3.2符合要求之治工具需張貼「XRF專用」標示始得使用，並收納於「XRF治工具專用櫃」中，以避免與其他工具混用，且嚴禁使用未標示之治工具。 The tool that had passed through XRF qualified. It should be labeled and separated. 3.3治工具於使用前或於拆解樣品A與樣品B之間，治工具需先要以酒精及棉布進行擦拭，並於檢驗完畢後須將工作台清潔乾淨，以避免測試樣品受污染。 It is necessary that cleaning by alcohol for the disassembly tools before to use or between the different samples, and that cleaning the worktable after inspection.

3.4治工具定期驗證：每季以XRF驗證治工具後之數據記錄於AT-0801-M427-F1，以供備查

Quarter inspection by XRF for tools and recording the result into AT-0801-M427-F1 3.5拆解樣品超標時：若樣品超標時，須以XRF檢驗拆解工具，以排除工具造成之污染

If the sample’s XRF test result is fail. The disassembly tools should be inspected by XRF to clarify the factor of contamination.

4. 上述測試方法為主要拆解原則，若客戶另有要求則依照其規範實施測試。

Above test methods are general rules for disassembly. If customers have further request

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for the test method, then we will follow their requirements.

七、附件Attachment

附件一：XRF測試零件及產品類別之有害物質限值表

Attachment 1: EHS threshold value of component type for XRF test 電子零件類 Component Type 測試零件 Main Category 零件類別 Detail 二極體(Diode) 電晶体(Transistor) 主動零件類 閘流体(Thyratron) Active 積体電路(Integrated circuit) FET 電容器(Capacitor) 電阻器(Resistor) 被動零件類 Passive 電感器(Inductance) 變壓器(Transformer) 記憶體零件CPU, CHIP SETS, EPROM, DRAM, SRAM, PAL, 類 Memory RAMDAC, ASIC CHIP. 有披覆之導線;裸導線; CABLE. cover of cable; nude of cable; cable Bonding wire, CONNECTOR, SOCKET, SWITCH, PIN HEADER, RELAY, SHORT 電機材料類 PLUG, WIRE (SILVER), Electrical COPPER WIRE, FUSE, FACK, BATTERY. 水晶振盪子、振盪器 Crystal, Oscillator 陶磁基片類(Ceramic) MIRROR 類 化學材料類 EPOXY RESIN,COATING ICP, IC測試 POSDER,RTV,SOLVENT等。 Chemical Test by ICP/IC 五金類材料，包括所有沖壓、壓鑄及其電鍍、皮膜、表面塗裝及五金材料類 組立等之五金件。All of the Metallic incoming metal part, include all stamping, die-casting and electroplate, wiper and assembly etc. 測試限值 Threshold Value XRF測試方法 鉛鎘汞鉻 *溴 *氯 * 溴(Br) Test Method (Pb) (Cd) (Hg) (Cr) (Br) (Cl) +氯(Cl) 700 700 1.DIP:Method 1 700 2.SMD:Method 2 700 700 1.DIP:Method 1 700 2.SMD:Method 2 700 Method 4 700 700 700 60 60 60 60 60 60 60 60 60 60 700 700 700 700 700 700 700 700 700 700 700 700 700 700 700 700 700 700 700 700 630 630 630 630 630 630 630 630 630 630 630 630 630 630 630 630 630 630 630 630 1050 1050 1050 1050 1050 1050 1050 1050 1050 1050 Method 2 700 60 700 700 630 630 1050 700 Method5 60 700 700 630 630 1050 700 700 700 60 60 60 700 700 700 700 700 700 630 630 630 630 630 630 1050 1050 1050 限值參閱綠色環保產品規格(AT-0801-R300) Threshold value refer to AT-0801-R300 Method 5 700 60 700 700 630 630 1050 最新范本,供参考！

所有一般進料之塑膠類材料，包括所有塑膠、橡膠及其組合件塑膠材料類 等。All of the incoming plastic Plastic part, include plastic, rubber and others assembly parts. 包裝類材料，包括所有彩盒、紙箱、棧板、保麗龍、EPE、塑膠袋、文件手冊及各種防靜電材料包裝材料類 等。All of the incoming Package packaging includes color box, carton, pallet, EPS foam, EPE form, plastic bag, document manual and ESD material. 單面板、雙面板及多層板印刷電印刷電路板路板。Single sided、double 類 PCB sided and multilayer board 各種電源供應器、記憶體模組、輸出入設備、各式介面卡、PC週邊材料類卡等。 Power supply、memory Periphery module、in-out put instrument、interface cards、PC cards etc. 產品類-PCBA Product type-PCBA Method 5 700 60 700 700 630 630 1050 Method 6 鉛+汞+鎘+鉻之總量小於100ppm 630 Pb+Hg+Cd+Cr < 100ppm Cd < 5ppm 630 1050 Method 3 700 60 700 700 630 630 1050 Method 7 700 60 700 700 630 630 1050 Method 8 700 60 700 700 630 630 1050 Remark: (*)無鹵材料，於進料驗收報告單上會加註”HF”標示，以通知IQC執行XRF無鹵素檢驗。

For Halogen Free components, There is a wording “HF” in incoming inspection sheet. IQC should to carry out halogen free inspection for the component.

1.上述零件及產品類別如測試方法不適用時,請採行method 9。

If the above-mentioned test method cannot be used on the materials and products, please follow method 9.

2.上表中之晶片電阻本體含有玻璃纖維而含鉛量甚高，故此零件之鉛含量將暫不設定管制上限，但該材料仍須檢測。 Due to lead in glass of Chip Resistor, lead (Pb) can be exempted from the requirement of above table, but the test results have to be kept.

3.上表中之晶片電容及鐵蕊電感因本體含有陶瓷而含鉛量甚高，故此類零件之鉛含量,將暫不設定管制上限，但該材料仍須檢測。

Due to lead in electronic ceramic parts (e.g. Chip Capacitor & Ferrite bead), lead (Pb) can be exempted from the requirement of above table, but the test results have to be kept.

4.上表中週邊材料若含有聚氯乙烯(PVC)電源線外被，其鉛含量不得大於300ppm。 If the above periphery type included the power cord made of PVC material. The threshold value of Lead substance is not over 300 ppm by XRF.

5.上表中材料若為金屬、玻璃及陶瓷材質(如USI 06大類)，則不需實施無鹵素檢驗，但

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材質若為添加塑料、油墨等組成之複合材料，該材料仍需實施無鹵素檢驗。

If the material compose of metal, glass and ceramic. The component won’t be carried out halogen free inspection. Otherwise, Shall carry out halogen free inspection depend on “HF” indication.

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附件二：拆解治工具管理流程

Attachment 2: The management process for disassembly tools of the component.

附件三：XRF治工具季驗證紀錄表XRF治工具季驗證紀錄表 (AT-0801-M427-F1)，此表格

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僅供TW/SH/SZ sites 使用.

Attachment 3: The record of disassembly tools in quarter inspection by XRF. (For TW/SH/SZ sites usage only)

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