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专利名称：Semiconductor device having multiple power
modules and cooling mechanism for thepower modules
发明人：Yusuke Ishiyama,Yuji Imoto申请号：US15231121申请日：20160808公开号：US09888617B2公开日：20180206
专利附图：
摘要：Provided is a semiconductor device having a small footprint, where the
semiconductor device includes multiple power modules and a cooling structure for these
power modules. The semiconductor device includes: a first power module on a first topplate of a coolant jacket; and a second power module on a second top plate of thecoolant jacket, where the second top plate face the first top plate. The coolant jacketincludes a first fin in contact with the first top plate in a passage, and a second fin incontact with the second top plate in the passage. The power modules face each otherthrough the top plates and the fins.
申请人：Mitsubishi Electric Corporation
地址：Tokyo JP
国籍：JP
代理机构：Studebaker & Brackett PC
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