专利内容由知识产权出版社提供
专利名称：CONNECTION STRUCTURE FOR
SEMICONDUCTOR DEVICE, ULTRASONICMODULE, AND ULTRASONIC ENDOSCOPESYSTEM HAVING BUILT-IN ULTRASONICMODULE
发明人：YAMADA, Junya申请号：EP13861652.9申请日：20131203公开号：EP2934024A1公开日：20151021
专利附图：
摘要：Provided is a semiconductor device connection structure capable of improvingadhesion strength without influencing performance of a semiconductor element by asimple method. The semiconductor device connection structure according to theinvention includes a silicon substrate having a plate shape and including an externalconnection electrode on a surface thereof; a support member which is adhered to a rearsurface of the silicon substrate and of which adhesion surface has a column shape that issubstantially same as that of the silicon substrate, a thickness of the support memberbeing larger than that of the silicon substrate; and a flexible board having an inner leadtherein configured to be connected to the external connection electrode. The flexibleboard is arranged on a side surface of the silicon substrate and is adhered to the supportmember with an adhesive.
申请人：Olympus Corporation
地址：43-2, Hatagaya 2-chome Shibuya-ku Tokyo 151-0072 JP
国籍：JP
代理机构：Gunzelmann, Rainer
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